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PEGACLSA_6.2V2 - Certified Lead System Architect (CLSA) 62V2 - Dump Information

Vendor : Pegasystems
Exam Code : PEGACLSA_6.2V2
Exam Name : Certified Lead System Architect (CLSA) 62V2
Questions and Answers : 149 Q & A
Updated On : December 13, 2018
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PEGACLSA_6.2V2 Questions and Answers

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PEGACLSA_6.2V2 Certified Lead System Architect (CLSA) 62V2

Study Guide Prepared by Killexams.com Pegasystems Dumps Experts


Killexams.com PEGACLSA_6.2V2 Dumps and Real Questions

100% Real Questions - Exam Pass Guarantee with High Marks - Just Memorize the Answers



PEGACLSA_6.2V2 exam Dumps Source : Certified Lead System Architect (CLSA) 62V2

Test Code : PEGACLSA_6.2V2
Test Name : Certified Lead System Architect (CLSA) 62V2
Vendor Name : Pegasystems
Q&A : 149 Real Questions

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Pegasystems Pegasystems Certified Lead System

Pegasystems' (PEGA) CEO Alan Trefler on Q2 2017 effects - earnings call Transcript | killexams.com Real Questions and Pass4sure dumps

No outcomes discovered, are trying new key phrase!They said “Pega was the best alternative when it comes to someone who unifies all these channels, inbound, outbound, all of the various things you need to use to discuss with purchasers when they're connected -- ...

LANIT Awarded Gold partner reputation by using Pegasystems | killexams.com Real Questions and Pass4sure dumps

MOSCOW and studying, uk--(Marketwire - might also 31, 2012) - LANIT today announced that its subsidiary "LANIT - BPM" has been signed as a Gold accomplice for Pegasystems Inc. (NASDAQ: PEGA), the leader in enterprise process administration (BPM) and utility for customer centricity. This appointment to Gold companion popularity is in consciousness of the success of "LANIT - BPM" in the formation of Russia's greatest team of licensed equipment architects of Pegasystems BPM.

"LANIT - BPM" specialises in flow-through company process automation and is the most effective accepted Pega partner in Russia. in line with Pega application, "LANIT - BPM" is driving a couple of predominant tasks enforcing BPM solutions for monetary corporations in Russia.

The partnership changed into launched in early 2011. After 12 months of working collectively in the Russian market "LANIT - BPM" has shown massive results within the introduction of an industrial product solution in accordance with Pega BPM, allowing modelling and automation of company processes in distinctive industries. The enterprise additionally reached the satisfactory saturation for Gold associate status in response to quantity of sold licenses and additionally its announcement of plans to raise earnings and develop industry-selected solutions for the existing yr. furthermore, "LANIT - BPM" has formed an excellent crew of totally expert authorities and due to the rapid building of business in Russia, the crew of professional analysts and BPM-licensed architects is still growing.

"We view 'LANIT - BPM' as a strategic accomplice for us in Russia and they have all of a sudden proven that they should still have Gold associate accreditation," says Benoit Chailloux, managing director, companions & Alliances, Pegasystems. "LANIT has already confirmed that they'll enormously enhance the work we're capable of do in bringing the numerous merits of the Pega answer to our purchasers within the location and have been key to the success that we are already seeing. we are longing for an extended and prosperous relationship."

About LANIT enterprise LANIT -- "Laboratory of new suggestions applied sciences" -- the leading Russian and CIS multidisciplinary group of IT organizations, which celebrated its twentieth anniversary in 2009. community corporations give a full range of IT features, whose quantity is frequently expanding due to building of advanced and most established technologies and solutions.

today LANIT is Russia's largest system integrator and a number one accomplice for more than 200 main producers of hardware and software solutions within the field of high technologies. A solid and highly professional group of greater than 4,000 individuals in total works in LANIT organizations. Many body of workers individuals have advanced levels. more than 1,000 are licensed gurus by using the realm's main providers of high-tech machine and software.www.lanit.ru

About "LANIT - BPM"

The company "LANIT - BPM" became dependent in early 2011 as part of a gaggle of corporations LANIT.

A key center of attention of the company is the introduction of built-in IT structures that deliver intelligent management of enterprise techniques and, due to this fact, boost the effectivity of companies in a number of industries. "LANIT - BPM" performs audit of consumer's enterprise procedures and full range of their automation, industrial implements BPM-solutions (business method administration), and offering integration with latest techniques, training and support. "LANIT - BPM" is an authorized associate of Pegasystems, a world chief among suppliers of BPM / CRM / BRM-choice-making, in Russia.

About Pegasystems Pegasystems, the leader in business technique management and utility for client centricity, helps agencies increase customer loyalty, generate new company, and increase productiveness. Our patented build for alternate® know-how speeds the birth of vital company solutions via directly taking pictures company pursuits and casting off manual programming. Pegasystems flexible on-premise and cloud-based options enable customers to right now adapt to changing enterprise situations in an effort to outperform the competition. For more advice, please visit us at www.pega.com

All emblems are the property of their respective house owners.

The assistance contained in this press liberate is not a dedication, promise, or legal duty to deliver any cloth, code or functionality. The construction, free up and timing of any aspects or performance described remains at the sole discretion of Pegasystems. Pegasystems especially disclaims any liability with appreciate to this suggestions.


Pegasystems Extends Cloud choice with Google Cloud Partnership | killexams.com Real Questions and Pass4sure dumps

Integration offers clients with much more alternate options to set up Pega functions

CAMBRIDGE, Mass., June 1, 2018 /PRNewswire/ -- Pegasystems Inc. (PEGA), the software business empowering customer engagement at the world's leading organizations, today introduced a partnership with Google Cloud to allow purchasers to run and installation Pega options on Google Cloud Platform (GCP). This reinforces Pega's commitment to give its valued clientele with the flexibleness to choose the correct deployment mannequin that suits their wants and keep away from vendor lock-in.

The company logo for Pega (PRNewsfoto/Pegasystems Inc.)

more

Agile groups want flexibility to select how they install and run mission-crucial applications in line with unexpectedly changing market dynamics. for example, many enterprises today operate in hybrid-cloud environments – similar to leveraging Pega's fully managed cloud functions whereas also self managing other cloud deployments to satisfy certain necessities. besides the fact that children, many competing cloud utility vendors present few pragmatic cloud platform decisions backyard their own, which limits clients' alternate options to adapt to new variables.

Pega's client engagement and digital system automation options work with no trouble across diverse cloud infrastructures, allowing companies to adapt their cloud techniques as company wants trade. with the aid of integrating with Google Cloud's world, at ease, and excessive-efficiency infrastructure, Pega allows its purchasers to leverage any latest GCP investments. Pega Cloud capabilities can additional speed up price from hybrid clouds with GCP and support organisations center of attention on their company, now not managing environments. GCP adds to Pega's roster of licensed cloud platform options, which comprises Microsoft Azure, Amazon net features, and Pivotal Cloud Foundry.

Google Cloud will also keynote at this yr's PegaWorld annual conference on June 3-6, 2018, in Las Vegas at the MGM Grand. James Stavropoulos, Google's world lead for community deployment operations, will join Pega's Kerim Akgonul to talk about how Pega utility and cloud functions are empowering companies to engage their customers, automate digital tactics, and right now construct vital apps.

charges & Commentary: "in their ongoing digital transformation journeys, groups want the flexibleness to speed up the value of cloud that goes beyond cost," spoke of Frank Guerrera, chief technical programs officer, Pegasystems. "Our partnership with Google Cloud allows for us to provide customers with the choice to leverage the energy of Pega on Google Cloud's comfortable and dynamic cloud platform. This expands our potential to empower consumers to choose the correct cloud answer that meets the challenges of nowadays and the next day."

assisting supplies:

About Pegasystems Pegasystems Inc. is the leader in software for customer engagement and operational excellence. Pega's adaptive, cloud-architected application – built on its unified Pega Platform – empowers americans to impulsively install, and simply lengthen and change purposes to fulfill strategic company needs. Over its 35-yr historical past, Pega has delivered award-successful capabilities in CRM and BPM, powered by superior synthetic intelligence and robotic automation, to assist the world's main manufacturers achieve breakthrough business consequences. For extra suggestions on Pegasystems (PEGA) seek advice from www.pega.com.

Press Contact: Sean AudetPegasystems Inc.Sean.Audet@pega.com (617) 528-5230Twitter: @pega 

Story Continues


PEGACLSA_6.2V2 Certified Lead System Architect (CLSA) 62V2

Study Guide Prepared by Killexams.com Pegasystems Dumps Experts


Killexams.com PEGACLSA_6.2V2 Dumps and Real Questions

100% Real Questions - Exam Pass Guarantee with High Marks - Just Memorize the Answers



PEGACLSA_6.2V2 exam Dumps Source : Certified Lead System Architect (CLSA) 62V2

Test Code : PEGACLSA_6.2V2
Test Name : Certified Lead System Architect (CLSA) 62V2
Vendor Name : Pegasystems
Q&A : 149 Real Questions

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Passing the PEGACLSA_6.2V2 examination become quite tough for me until i used to be added with the question & answer by way of killexams. some of the topics regarded very tough to me. attempted plenty to examine the books, however failed as time turned into brief. in the end, the sell off helped me understand the topics and wrap up my guidance in 10 days time. excellent manual, killexams. My heartfelt thanks to you.


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How These Services Stocks are Faring? -- Team Health, Allegion, Kratos Defense & Security Solutions, and Korn/Ferry | killexams.com real questions and Pass4sure dumps

NEW YORK, October 20, 2016 /PRNewswire/ --

The Services sector comprises various industries, which include warehousing and transportation services; information services; investment services; health care and social assistance services; and recreation services, etc. Companies in this space generally offer dividend yields that are above average when compared with the wider market. Today, Stock-Callers.com takes note of the following equities: Team Health Holdings Inc. (NYSE: TMH), Allegion PLC (NYSE: ALLE), Kratos Defense & Security Solutions Inc. (NASDAQ: KTOS), and Korn/Ferry International (NYSE: KFY). Register now and get full and free access to our downloadable research reports on these stocks at:

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Team Health  

Shares in Knoxville, Tennessee headquartered Team Health Holdings Inc. ended Wednesday's session at $40.30, rising 0.12%. The stock recorded a trading volume of 3.28 million shares, which was above its three months average volume of 765,570 shares. The Company's shares have surged 28.71% in the last one month. The stock is trading 15.43% above its 50-day moving average. Moreover, shares of Team Health Holdings, which provides outsourced healthcare professional staffing and administrative services to hospitals and other healthcare providers in the US, have a Relative Strength Index (RSI) of 67.91.

On October 3rd, 2016, TeamHealth Holdings announced the acquisition of Florida Emergency Physicians (FEP). Based in Orlando, Florida, FEP is the exclusive emergency medicine staffing provider for 11 facilities spanning five counties within the Florida Hospital health system. FEP comprises approximately 150 physicians and 100 advanced practice clinicians who provide care for 600,000 patients each year. Access our complete research report on TMH for free at:

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Allegion  

Dublin, Ireland headquartered Allegion PLC's stock saw a decline of 1.03%, closing the day at $67.20. A total volume of 613,873 shares was traded, which was higher than their three months average volume of 607,550 shares. The Company's shares have advanced 2.50% on an YTD basis. The stock is trading 1.87% above its 200-day moving average. Additionally, shares of Allegion, which manufactures and sells mechanical and electronic security products and solutions worldwide, have an RSI of 44.83.

On September 29th, 2016, Allegion announced that it will release its Q3 2016 financial results on October 27th, 2016, before the market opens. On the same day, David D. Petratis, chairman, president and CEO, and Patrick Shannon, senior vice president and chief financial officer, will conduct a conference call for analysts and investors, beginning at 8:30 a.m. ET, to review the company's results.

On October 17th, 2016, research firm CLSA upgraded the Company's stock rating from 'Outperform' to 'Buy'. The complimentary research report on ALLE can be downloaded at:

http://stock-callers.com/registration/?symbol=ALLE

Kratos Defense & Security Solutions  

On Wednesday, shares in San Diego, California headquartered Kratos Defense & Security Solutions Inc. recorded a trading volume of 175,461 shares. The stock ended the day 0.78% lower at $6.33. The Company's shares have gained 40.04% in the previous three months and 54.39% since the start of this year. The stock is trading above its 200-day moving average by 32.18%. Furthermore, shares of the company, which provides mission critical products, solutions, and services primarily for the Government and commercial customers, have an RSI of 40.75.

On October 17th, 2016, Kratos announced that it has been awarded a $12.6 million contract with Defense Innovation Unit Experimental (DIUx), in coordination with STRATCOM and the Strategic Capabilities Office, to explore the use of high speed drones in either fully autonomous or semi-autonomous roles to support fourth and fifth generation fighter aircraft. The article notes that DIUx has contracted with Kratos for the integration of certain sensors into the UTAP-22, flight services, and for Kratos UTAP-22 to demonstrate in a large, complex exercise. Register for free on Stock-Callers.com and get access to the latest PDF format report on KTOS at:

http://stock-callers.com/registration/?symbol=KTOS

Korn/Ferry  

Los Angeles, California-based Korn/Ferry International's stock saw a decline of 0.10%, finishing yesterday's session at $20.90 and with a total trading volume of 290,591 shares. The Company's shares have advanced 0.62% in the last month. The stock is trading below its 50-day moving average by 6.84%. Additionally, shares of Korn/Ferry International, which together with its subsidiaries, provides talent management solutions worldwide, have an RSI of 40.28.

On October 17th, 2016, the Futurestep division of Korn/Ferry announced the launch of a dedicated Healthcare Technology & Services Practice. This new Practice will be a direct extension of Korn/Ferry's market-leading Healthcare Technology Executive Search Practice, which brings unparalleled industry expertise, having completed more than 600 executive engagements across the Healthcare Technology Sector since 2003. Jessica Johnson has been named Sector Leader, Healthcare Technology & Services Futurestep. Johnson has been a core member of Korn/Ferry's Healthcare Technology Practice for more than 10 years. Download your free research report on KFY at:

http://stock-callers.com/registration/?symbol=KFY

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Citrix Systems Management Discusses Q3 2013 Results - Earnings Call Transcript | killexams.com real questions and Pass4sure dumps

No result found, try new keyword!Citrix Systems (NASDAQ:CTXS) Q3 2013 Earnings Call October 23 ... we believe there's a solid multiyear product cycle ahead for customers of all sizes, as they refresh their IT architecture to support ...

OSAT Consolidation Continues | killexams.com real questions and Pass4sure dumps

Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries Ltd. (SPIL) are beginning the process of uniting the two companies, which are among the largest outsourced semiconductor assembly and testing contractors in the world.

For now, the companies will continue to operate separately, while their shares are traded under the ASX symbol on the New York Stock Exchange. ASE Industrial Holding serves as the parent company for ASE and SPIL. But the merger is almost certain to change the competitive landscape in the assembly, packaging and test markets.

All of these areas are tough markets. ASE posted net income of $670 million on 2017 revenue that was just slightly shy of $9.8 billion. While that may seem like a lot of money, compared with many segments in the technology world it’s a tight operating margin.

The ASE/SPIL deal is being very closely watched by Amkor Technology, JCET Group, and smaller contractors. OSATs are not just competing among themselves anymore. Increasingly, they are facing competition from TSMC, UMC and other foundries, which have pressed into chip packaging and testing services for several years now. There are also internal assembly and testing operations at some of the bigger semiconductor vendors, such as Intel, Samsung Electronics, and Texas Instruments, that take away certain business opportunities.

“There are a bunch of pressures in the OSAT business that will shape the industry in coming years,” says Risto Puhakka, president of VLSI Research. TSMC is competing in the high-end packaging business, with Apple as its big customer, and integrated device manufacturers are also competing in that field, he notes. (TSMC’s largest customer, not identified in its most recent 20-F filing, accounted for 22% of the foundry’s 2017 net revenue.)

There is more competition on the horizon, too. “The other pressure point that the OSATs feel is China,” says Puhakka. “There’s a substantial amount of packaging coming up in China, with the much lower cost, whether it’s through subsidies or something else. There is definitely pressure at the low end. It comes in the form of price pressure. Because the OSATs want to keep up the volume; their pricing is a much tougher environment. If you look at those two trends, you see people probably want to get bigger, they want to be operating in China, they want to be more competitive. The cycle in R&D is to get back that high-end business, and there are a number of things pushing in those directions. If you look at the OSAT business last year, there was growth, but nothing spectacular. Then, you look at the assembly equipment demand, which was spectacularly hot, which means a lot of equipment went to others—other than the traditional OSATs. It went mainly to China, to IDMs, to TSMC, Samsung.”

China’s OSAT industry is mostly made up of smaller firms, aside from Jiangsu Changjiang Electronics Technology (JCET), which owns STATS ChipPAC and other companies. JCET acquired STATS ChipPAC in 2015.

ASE and SPIL will be involved in integration initiatives in the near future, according to Puhakka. “The bigger question is, what will Amkor do? What will JCET do? The big players may want to buy from China. That’s not out of the question, but there would be some regulatory hurdles, I would imagine, to do that.”

The large OSATs today have geographically diverse operations throughout Asia. But China represents the largest growth opportunity.

“It is a market not to be ignored,” he says. “It just that you have the Chinese regulations, the requirement of joint ventures and technology transfers. It makes people very uneasy to do something like that. Those kinds of actions have limited how much business transfers to China. If you’re operating in China, you have ongoing IP protection issues. You’re constantly making decisions about what IP are you moving to China, what are you not. By default, people are basically saying, whatever you move to China, it becomes Chinese knowledge.”

Fig. 1: Pressures mount for OSATs. Source: CLSA

Bigger dealsJust as more limited opportunities and growing R&D investments fostered some mega-deals in the semiconductor business, similar forces are at work in the assembly, package and test world, which serves the semiconductor companies.

“It was certainly no surprise that ASE and SPIL came together, because of the increasingly challenging OSAT business environment and the major consolidation we’re seeing in our customer base,” says Hal Lasky, senior vice president of sales and marketing for JCET Group, who also serves as executive vice president and chief sales officer for STATS ChipPAC. “It’s kind of inevitable that we would see this at the OSAT level. Clearly, we’re a part of that as well, as we are now a part of the JCET Group. What does it mean for the competition? As a company, we embrace this change, and we see many opportunities arising due to this merger. There are many semiconductor companies, our customers, who see a combined market share of ASE and SPIL within their own TAM. I call it unhealthy, or maybe a little too high. We’ve had many chances to compete for market share where, without this merger, we wouldn’t have. I absolutely believe this merger enhances the competitive nature of the OSAT space. Maybe it gives us a higher bar to shoot at, which is not necessarily a bad thing for this very competitive OSAT industry.”

Lasky anticipates there will be more consolidation ahead, for the OSAT segment in particular, and the semiconductor industry in general.

“In the OSAT space, while I do expect us to follow the trend, we won’t see quite the pace. There is still a chance to see continued OSAT consolidation, but maybe not at the pace of our customer set. And the issue with OSATs is that the long tail of our industry—where the small players are not always of interest for M&A for the larger OSAT because the return you get versus the alternative of just competing for the business—when you look at that and the ROI and the deal around that, it doesn’t come out in favor of acquisition. Also, in the OSAT space, the technology gap between top-tier OSATs and the smaller OSATs continues to grow. That has an impact on the interest level in the larger OSATs to drive M&A with smaller ones.”

So rather than accelerating consolidation, consolidation among OSATs actually could slow down, he says. At the same time, TSMC will continue to compete with OSAT contractors in IC packaging services. “Their solutions in the wafer-level space—InFO and CoWoS—those are outstanding packaging solutions. They are targeted at key segments in our customer space, and they are staking out their portion of the application space. Within the overall application space, there is a very good fit for those products. They’re investing in the back end, and they’re doing it in a way that makes sense to their business. And it lets them optimize their overall business model. I see them continuing with that and continuing to stake out that position. While that’s certainly a challenge to the OSAT space, it’s not really a killer. But we need to adapt to that.”

Peaceful coexistence?So can foundries and OSATS live and work together?

“There’s no question that the answer to that is yes,” Lasky says. “I believe very strongly that there’s plenty of opportunity. As we adapt to that shift in TAM, it’s mostly TSMC when you look at it, the bottom line is I believe very strongly in the spirit of co-opetition, because we continue to work very closely with the foundries to take care of and support our customers. Key to how we adapt as an OSAT industry really is finding where our strengths and our capabilities in the OSAT industry can take advantage of new growth areas, to take TAM back versus losing it to the foundries.”

The system-in-package module space is one area where OSATs can really shine, Lasky asserts.

“When these higher-level solutions involve multiple die, multiple devices, and you need to integrate at the packaging level to create a packaging-level solution, suddenly you need the abilities of OSATs, where in the past you might have done that as an EMS board-level solution,” he says. “There’s miniaturization, there are shielding concerns, there are a lot of different intricate process-level concerns, and it’s required at a very high yield. And those are all things that we play well in. We’re starting to see our TAM actually grow in that space in the OSAT world. There is no one packaging solution that’s going to wallpaper the entire application space. You need to find your strengths, find where your capabilities can let you grab share, and then go for that. Even in wafer-level, where the foundries have the very strong solutions for some of these processors, we have our own fan-out wafer-level and wafer-level CSP solutions that don’t make sense in the foundry space. The OSAT can do a better job.”

Ron Huemoeller, corporate vice president of Amkor and head of corporate R&D, likewise sees big changes and challenges in the OSAT industry.

“It’s a changing competitive environment and the OSAT market continues to narrow at the top, with only two OSATs remaining dominant in all phases of technology, ASE and Amkor, following the merger of SPIL and ASE. With fewer choices, more dependence on the premier OSATs is inevitable. It is important to note that developing and manufacturing new package platforms is expensive, and it requires a high degree of engineering expertise. It also requires perpetual funding in R&D to maintain competitiveness. Adding new blocks of capacity is very expensive – continually challenging ROI.”

Whether that will lead to more consolidation, and how quickly, remains to be seen.

“The OSAT business requires scale,” says Prasad Dhond, Amkor’s vice president and general manager of automotive. “There will continue to be some level of consolidation as players try to combine their resources to compete. This might now be more applicable to the smaller (Tier 2 and Tier 3) players, though. Foundries are making a push into certain segments of high-end packaging. They view this as an opportunity to cross-sell additional services and also to make their business stickier. However, from a fundamental business model standpoint, packaging margins are lower than what foundries are used to. It is not clear if foundries will be willing to make heavy CapEx investments in packaging when they could be using the capital for something else.”

So does that mean everyone will co-exist in their own space?

“One of the key aspects of foundry success in entering into the OSAT market segment is the bundling of their silicon with advanced packaging technology,” Huemoeller observes. “They secure the silicon sale by attaching it to the package technology. Foundries and OSATs are key components of the ecosystem. The foundries won’t engage in all aspects of the assembly and test business. There are niche areas they will play in, but there will always be a need for them to work with OSATs for other applications and if volumes exceed certain thresholds.”

Behind the ASE-SPIL dealIn its 20-F filing with the Securities and Exchange Commission for 2017, ASE provided an in-depth look at market pressures and developments in this space.

“We have significantly expanded our operations through both organic growth and acquisitions in recent years,” ASE says. “For example, we acquired the controlling interest of Universal Scientific in 2010 to expand our product offering scope to electronic manufacturing services; we also entered into a joint venture agreement with TDK Corporation in May 2015 to further expand our business in embedded substrates; in June 2016, we entered into the Joint Share Exchange Agreement with SPIL to take advantage of the synergy effect of business combination between SPIL and us; furthermore, we entered into a joint venture agreement with Qualcomm Incorporated in February 2018 to expand our SiP business. We expect that we will continue to expand our operations in the future. The purpose of our expansion is mainly to provide total solutions to existing customers or to attract new customers and broaden our product range for a variety of end-use applications. However, rapid expansion may place a strain on our managerial, technical, financial, operational and other resources. As a result of our expansion, we have implemented and will continue to implement additional operational and financial controls and hire and train additional personnel. Any failure to manage our growth effectively could lead to inefficiencies and redundancies and result in reduced growth prospects and profitability.”

It adds, “The successful consummation of the SPIL Acquisition is subject to a number of factors, including, among other things, obtaining all necessary antitrust or other regulatory approvals in Taiwan, the United States, the PRC and other jurisdictions where we do business. We received a no-objection letter in respect of the Share Exchange from the TFTC on November 16, 2016. On May 15, 2017, we received a letter from the FTC confirming that the non-public investigation on the Share Exchange has been closed. On November 24, 2017, we received approval from the Ministry of Commerce of the People’s Republic of China (MOFCOM) for the Share Exchange under the condition that ASE and SPIL maintain independent operations, among other conditions, for 24 months. In the event these conditions cannot be satisfied, we may re-evaluate our interest in SPIL and may consider, among other legally permissible alternatives, to dispose our SPIL shares at a loss, which may significantly affect our financial position. Notwithstanding the above, even if we are successful in consummating the SPIL Acquisition, we will be subject to regulatory restrictions requiring us to maintain separate operation of SPIL for a period of time, and we may face challenges in successfully integrating SPIL into our existing organization or in realizing anticipated benefits and cost synergies afterwards. Each of these risks could have a material adverse effect on our business and operations, including our relationship with customers, suppliers, employees and other constituencies, or otherwise adversely affect our financial condition and results of operations.”

The 20-F says, “The packaging and testing business is capital-intensive. We will need capital to fund the expansion of our facilities as well as fund our research and development activities in order to remain competitive. We believe that our existing cash, marketable securities, expected cash flow from operations and existing credit lines under our loan facilities will be sufficient to meet our capital expenditures, working capital, cash obligations under our existing debt and lease arrangements, and other requirements for at least the next twelve months. However, future capacity expansions or market or other developments may cause us to require additional funds…If we are unable to obtain funding in a timely manner or on acceptable terms, our results of operations and financial conditions may be materially and adversely affected.”

ASE has a co-opetition relationship with TSMC. The two companies have had a “strategic alliance” since 1997. ASE serves as the foundry’s non-exclusive, preferred provider of packaging and testing services for microchips fabricated by TSMC.

ConclusionWhile OSATs will have one larger competitor to deal with in the near future, those companies look forward to the fray. TSMC’s muscling in on the high-end packaging business, especially when it comes to Apple’s custom application processors for the iPhone and the iPad, is a competitive challenge.

Yet OSATs retain expertise in the areas of SiP modules, molded interconnect substrates, substrate-like printed circuit boards, semiconductor embedded in substrate, and other emerging technologies. And while competition continues to ratchet up, there are always new opportunities around the edges for companies with the expertise and investment dollars to continue eking out a healthy living.

Related StoriesMIS Packaging Takes OffMolded interconnect substrate emerges as packaging choice for analog, power ICs and cryptocurrency chips.Toward High-End Fan-OutsDenser interconnects, stacked die could rival 2.5D approaches.What Next For OSATsASE’s COO opens up on the future of fan-out, growth prospects, and where the next opportunities will show up.



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References :


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Pegasystems PEGACLSA_6.2V2 Exam (Certified Lead System Architect (CLSA) 62V2) Detailed Information



References:


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